Predict that the global Wire Wedge Bonder Equipment market will grow steadily during the next five years and post a CAGR of nearly 1.04% by 2022

Market research analysts at QYResearch predict that the global Wire Wedge Bonder Equipment market will grow steadily during the next five years and post a CAGR of nearly 1.04% by 2022. This market research analysis identifies the increasing design complexity of semiconductor devices as one of the primary growth factors for the global Wire Wedge Bonder Equipment market. The rise in design complexities such as slimmer version, use of metallic case, and larger displays in smartphones and other electronics has reduced the space for semiconductor components. This in turn, increases the complexity of the design and the development of semiconductor devices and increases the need for new processing tools and equipment to manufacture them. Moreover, the constant introduction of new electronics such as smartphones with improved features also compels vendors to modify the manufacturing process and design new products compatible with the existing and new standards, which will subsequently propel the market’s growth.

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The Wire Wedge Bonder Equipment market is a part of the overall semiconductor packaging and assembly equipment market. The shift in semiconductor packaging towards 3D IC technology will intensify the competition between the IDMs and OSATs. The packaging market has a huge potential and provides several growth opportunities to IDMs and OSATs. IDMs are working on expanding into the assembly business, while the OSATs are trying to make use of this opportunity to raise the profit margins. In 2016, IDMs held the maximum market shares during 2016 and this segment is projected to continue its market dominance during the forecasted period as well. The need to increase production capacity and the need to adhere to the constant technological innovation in packaging techniques will be the major factors fueling market growth. Furthermore, the rising R&D activities and the adoption of innovative technologies by the semiconductor packaging industry, will also drive the growth of the Wire Wedge Bonder Equipment market in this end-user segment.

Wire Wedge Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Europe, US and Asia. Among them, Singapore output volume accounted for more than 53.24% of the total output of global Wire Wedge Bonder Equipment in 2016. Kulicke & Soffa is the world leading manufacturer in global Wire Wedge Bonder Equipment market with the market share of 54.19%, in terms of revenue, followed by ASM Pacific Technology (ASMPT), Hesse, Cho-Onpa and F&K Delvotec Bondtechnik. Compared to 2015, Wire Wedge Bonder Equipment market increased sales by 1.28 percent to 90.23 million USD worldwide in 2016 from 89.09 million USD in 2015. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment. The global Wire Wedge Bonder Equipment market is expected to reach $96.62 million by 2022 from $91.73 million in 2017, growing at a CAGR of 1.04% from 2017 to 2022.

The Global Wire Wedge Bonder Equipment Market Research Report 2018 report released by QYResearch provides a basic overview of the Wire Wedge Bonder Equipment industry, including definition, classification, application and industrial chain structure. Discuss development policies and plans as well as manufacturing processes and cost structures.

The report then focuses on major industry players in Global, including company profiles, product images and specifications, sales, market share, and contact information. More importantly, the Wire Wedge Bonder Equipment industry development trends and marketing channels were analyzed. Providing the main statistical data on the current status of the industry is a valuable guide and direction for companies and individuals interested in the market.

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